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Our start-up client is currently searching for an IC Packaging Engineer to be responsible for supporting advanced assembly process and power package technology development within the company. The role will require liasing with various subcontractors and to be involved with the project management of new packages such as MLP/MLF/QFN's and clip die attached products.

Desired qualifications are as follows;

-Semiconductor packaging experience (MLP/MLF/QFN packages)
-Familiarity with Clip die attach product
-Familiar with high volume semiconductor manufacturing environment
-Excellent communication skills.
-BSc Physics / Electronic Engineering or equivalent

Please contact us for additional information.