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Packaging Market - Technical Marketing Support.

Our client is a leading European Semiconductor manufacturer and they are seeking to appoint an experienced person for their Packaging Technical Marketing Support role based at their China operation.

Areas of Responsibility: (ranked by importance)

- Discuss with customer or teach them how to use module for card implanting, how to optimize their process to adapt to our module
- Help customer to resolve quality problem (package related)
- Feedback to internal function, Engineering, Quality, Production, etc. about customer concern

Measurement Criteria: (quantitative, qualitative; related to the areas of responsibility)

- Promotion of new package/product, like FCOS/M4.8/FCOS 6 pin silver/MCC8-2-3 for ePassport application
- Sales & Marketing for AMON Packaging business development
- Business development for module packaging if idle capacity
- Regular customer visit
- Quarterly visit customer for any feedback, discussion, info exchange each other and keep good relationship

Influence: (Possible levels of responsibility are Full (F) and Partial (P)

- Promote brand: seminar speaker, advertisement, exhibition, event sponsorship
- Promotion of client product/package on some occasions, eg. Card show
- Networking with system integrators, gov't, standardization group
- Networking with customer, production, engineering, and quality
- Interface of internal and external, understanding each other about process, quality
- Prepare market & competitor analysis

Job Requirements

Education: Degree
Experience: Chip card technical background, semi-conductor working experience