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Our client is currently looking for an IC Package Integration Engineer to work on roadmaps of available packaging technologies with the company and Far Eastern subcontractors. The role will involve defining technical qualification requirements and performing feasibility studies. Driving packaging cost reduction programs will be part of the role and supporting packaging DOE.

Required attributes include the following,

Strong semiconductor packaging experience (including design rules and JEDEC)
Knowledge of the semiconductor manufacturing environment
Subcon knowledge
Excellent communication skills
BSc Physics, Electronics or equivalent

Please call to discuss further.