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National's most advanced die fab came on line in 1997 with a high level of automation.   National currently employs a highly skilled workforce of 600 who provide the company CMOS and BiCMOS process and manufacturing expertise.  These technologies are key to National's success in creating analog-intensive solutions for the consumer electronics marketplace.   The Maine site is committed to the community, is one of the area's largest employers, and consistently receives environmental, health, and safety commendations from local, state, and federal governments
 
Overall Responsibilities:

• Establish and characterize new I-line and DUV photolithography processes for CMOS, Bipolar and BiCMOS technologies.

• Work hand-in-hand with the Fab engineering group to meet quality, yield, and cost goals.

• Provide in-depth knowledge and guidance for process interactions between photo, etch, implant, epi, films, metrology, integration and yield in order to maximize process robustness.

• Create and maintain litho process and equipment roadmaps to support strategic planning.

• Be a technical lead in a diverse team environment that includes interactions with manufacturing, R&D, suppliers, internal and external customers.

Specific Requirements:

• Extensive knowledge of I-line and DUV photolithography processes, equipment, and industry standards and capabilities.

• In-depth experience in semiconductor manufacturing process development including characterization of resist processes, optical lithography modeling and simulation, statistical methods and experimental design,

• Knowledge of resolution enhancement techniques.

• Practical, hands-on experience with photolithography equipment including steppers, scanners, resist tracks and CD SEMs.

• Thorough understanding of primary tool components and theory of operation.

• Excellent written and verbal communication skills with the ability to present and influence to a wide range of internal and external technical customers

Qualifications/Experience

Education: M.S. or Ph.D. in microelectronics engineering, physics, or related field.

Experience: Minimum of  5 years recent experience in photolithography; other process development experience desirable.  Advanced knowledge of semiconductor wafer processing specific to the 200mm .18 technology node is a must.

As an equal opportunity employer, National Semiconductor encourages and supports a diverse workplace