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National's most advanced die fab came on line in 1997 with a high level of automation.   National currently employs a highly skilled workforce of 600 who provide the company CMOS and BiCMOS process and manufacturing expertise.  These technologies are key to National's success in creating analog-intensive solutions for the consumer electronics marketplace.   The Maine site is committed to the community, is one of the area's largest employers, and consistently receives environmental, health, and safety commendations from local, state, and federal governments
 
Overall Responsibilities:  

• Provide technical leadership while developing advanced etch processes for CMOS, BCDMOS, Bipolar, and BiCMOS technologies.

• Produce modules that extend the capability of existing core technology platforms using a skillful, hands-on approach.

• Work in a diverse team environment consisting of integration & manufacturing engineers, R&D, and tool suppliers.

Skills:

• Extensive knowledge of etch processes, equipment, industry standards and capabilities.

• Ability to develop and characterize etch modules using experimental design, statistical methods, and material analysis techniques.

• Practical knowledge of plasma etch chemistry, profile/feature evolution, and how etch characteristics relate to process architecture.

• A complete understanding of process variation contribution by hardware sub-systems such as vacuum, RF, gas flow, and chamber conditioning.

• Experience in tool start-up, qualification, and assessment of capability extension via hardware upgrades.

Education:

B.S., M.S., or Ph.D. in microelectronics engineering, physics, or related field.  Minimum of 5 years direct activity in etch, with recent process module development experience at or below the 180nm technology node is a must.

As an equal opportunity employer, National Semiconductor encourages and supports a diverse workplace